We check the scattering of your MEMS manufacturing batches or qualify them for HiRel markets.
Dedicated standards: JEDEC, SEMI.
We characterize Front or Back-end defects of your MEMS chips, to help you improving their reliability / robustness.
We evaluate your MEMS lifetime, according to their aimed mission profiles.
MEMS devices raise some specific issues.
Applying our expertise, we support you on the following topics :
Functional layer thickness measurement by FIB or cross-section.
Infrared imaging of badly etched oxide layers.
3D imaging of a particle deposited on a mirror.
SEM imaging of a sealing material in composition contrast.
SEM imaging before wirebond pull test.
Bare die cross-section to image the root cause of the defect (process).
Shortcut localization by Lock-in Thermography.